| http://www.w3.org/ns/prov#value | - Then, the encapsulating resin 9 is allowed to flow into the space formed by the device-mounting film portion 91 b and the surface of the LSI chip 8, thereby fixing and mounting the LSI chip 8 with respect to the device-mounting film portion 91 b. [0130] Next, the external-connection film portions 91 c and 91 e are respectively bent 180??? at the bending portions 91 d and 91 f in such a manner as t
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