| http://www.w3.org/ns/prov#value | - The base plates 1 for use in the present invention may be any ones having been used in conventional ion-etching processes, exemplified by metallic plates, such as copper plates, iron plates, aluminum plates, nickel plates, stainless steel plates, silicon wafers, alloy plates, such as Cr-20% SiO plates, copper or iron plates plated with nickel, non-metallic plates, such as glass plates and syntheti
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