| http://www.w3.org/ns/prov#value | - The present invention is a fabrication process of a wiring board which comprises a wiring conductive line embedded in the surface of an insulating substrate so that the upper face of the conductive line and the surface of the substrate are flat, and a through-hole land which is a conductive portion projected from the surface of the substrate in a through-hole portion, which is characterized in rem
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