| http://www.w3.org/ns/prov#value | - While each wafer is subjected to a single cycle in a processing chamber in which the temperatures may rise and fall, and where a film thickness measured in microns is deposited on the wafer, the holders, and particularly the clamping rings that urge the wafers against the holders, are exposed to a large number of cycles in each of which the temperatures are cycled from maximum to minimum and in th
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