| http://www.w3.org/ns/prov#value | - BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWINGS [0018] The invention is illustrated in the following figures, wherein: [0019]FIG. 1 is a perspective view of a wire-bonded Chip On Board (COB) semiconductor device of the invention; [0020]FIG. 2 is a perspective view of a flip-chip Chip On Board (COB) semiconductor device of the invention; [0021]FIGS. 3A through 3G are cross-sectional views of
|
