| http://www.w3.org/ns/prov#value | - The wafer may further include at least a portion of an integrated circuit (IC), a thin-film head die, a micro-electro-mechanical system (MEMS) device, flat panel displays, magnetic heads, magnetic and optical storage media, other components that may include photonics and optoelectronic devices such as lasers, waveguides and other passive components processed on wafers, print heads, and bio-chip de
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