| http://www.w3.org/ns/prov#value | - When the predetermined time has passed and the high temperature heat treatment was finished, output of the lamps 12 is reduced to lower the temperature of the wafer W. The method for heat treatment of the present invention is a method characterized in that it uses a temperature decreasing rate of 20??? C./sec or less for the region of from the maximum temperature to 700??? C. When this method is p
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