| http://www.w3.org/ns/prov#value | - Therefore, a chip of a standard size of flip-chip (thickness: 0.3 to 0.625 mm) becomes too large in its warp to be capable of securing sufficient accuracy. [0060] Thus, due to discrepancy of the thermal expansion coefficients of constituent elements of a semiconductor package, there occur problems such as destruction and peeling of the semiconductor element, destruction and peeling of the under-fi
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