| http://www.w3.org/ns/prov#value | - The dust particles thus generated may adhere to the surface of a lens used in the defect inspecting system or exposure system, or they may contaminate the interior of a chamber or adhere to the surface of a semiconductor wafer, which would cause deterioration of the pattern inspection accuracy or transfer accuracy, or a defect such as a short-circuit or open-circuit defect of a pattern may occur,
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