| http://www.w3.org/ns/prov#value | - The first and second interconnect structures are electrically connected through the conductive pillar.In another embodiment, the present invention is a method of making a semiconductor device comprising the steps of forming a first interconnect structure including wettable contact pads and UBM fixed in position relative to the contact pads,forming a conductive pillar over the wettable contact pads
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