| http://www.w3.org/ns/prov#value | - The solvent preferably used in the dental adhesives of the present invention includes volatile organic solvents having boiling point below 200 ??? C. at atmospheric pressure, for example, alcohols such as methanol, ethanol, allyl alcohol, isopropanol and 1-octanol; ketones such as acetone, methyl ethyl ketone and phorone; ethers such as ethyl ether, 1,4-dioxane, diethylene glycol and diethyl ether
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