| http://www.w3.org/ns/prov#value | - The invention also includes an alignment...http://www.google.fr/patents/US6232146?utm_source=gb-gplus-shareBrevet US6232146 - Semiconductor device including combed bond pad opening, assemblies and methods Recherche avanc???e dans les brevets Num???ro de publicationUS6232146 B1Type de publicationOctroi Num???ro de demandeUS 09/314,873 Date de publication15 mai 2001 Date de d???p???t19 mai 1999 Date
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