| http://www.w3.org/ns/prov#value | - The IC chip includes: an inner pad disposed on an active face and in an area where is overlapped, with the piezoelectric resonator when viewed in plan; an insulating layer formed on the active face; a relocation pad disposed on the insulating layer and in an area other than a part where is overlapped with the piezoelectric resonator element, the relocation pad being coupled to an end part of a fir
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