| http://www.w3.org/ns/prov#value | - The thinning of the first microelectronic wafer 102 may be carried our by any process known in the art, including but not limited to grinding (preferred), spin etching, and/or chemical mechanical polishing. [0030] A plurality of conductive vias 136 are then formed to extend from the first microelectronic wafer thinned back surface 134 to the first microelectronic wafer integrated circuitry layer 1
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