| http://www.w3.org/ns/prov#value | - he lead frame assembly and the heat sink except the portion of the distal ends of the leadframe fingers and a second surface of the heatsink, wherein the encapsulation package is formed by placing the semiconductor die, heatsink and leadframe assembly into a mold, the plurality of posts engaging a first inside surface of the mold and biasing the second surface of the heatsink toward a second insid
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