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  • he invention;FIG. 2 is a plan view illustrating the semiconductor device of FIG. 1;FIG. 3 is a sectional view taken along line B-B' of FIG. 2 and showing a semiconductor device;FIG. 4 is a sectional view taken along line B-B' of FIG. 2 and showing a step included in a semiconductor device manufacturing method according to a first embodiment;FIG. 5 is a sectional view taken along line B-B' of FIG.
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