| http://www.w3.org/ns/prov#value | - The wafer level testing and bumping process includes at least the following steps: (a) forming at least a flip-chip bonding pad as well as a test pad on the active surface such that the test pad is located at the periphery of the active surface but is electrically connected to the flip-chip bonding pad; (b) forming at least a fuse window on the active surface such that the fuse window is at a leve
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