| http://www.w3.org/ns/prov#value | - The via has a sidewall oxide 131 and is filled with a conductive material such as metal or doped...http://www.google.ca/patents/US5646067?utm_source=gb-gplus-sharePatent US5646067 - Depositing multilayer barrier and adhesion materialAdvanced Patent SearchPublication numberUS5646067 APublication typeGrantApplication numberUS 08/461,951Publication date8 Jul 1997Filing date5 Jun 1995Priority date5 Ju
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