| http://www.w3.org/ns/prov#value | - When the substrate material is a wafer to be processed in the manufacture of integrated circuit chips, it will typically be composed of such materials as silicon, polysilicon, garnet, binarys such as gallium arsenide and indium phosphide, also ternarys such as CdHgTe, GaAlAs and GaInP, and quaternarys such as GaInAsP. Other substrate materials which may be treated by this etching, cleaning, and/or
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