| http://www.w3.org/ns/prov#value | - The substrate for mounting an IC chip according to the first aspect of the fifth group of the present invention is a substrate for mounting an IC chip comprising: a substrate, as serially built up on both faces thereof, a conductor circuit and an interlaminar insulating layer in an alternate fashion and in repetition; a solder resist layer formed as an outermost layer; and an optical element mount
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