| http://www.w3.org/ns/prov#value | - Conductive lines 154 in combination with contact features 130CF provide conductive interconnects that connect contact pads 150 to contact pads 130C. Conductive lines 154 may also connect the contact pads 150 and contact features 130CF to transistors or other devices formed in or over substrate 110. [0014] Die 104.1 is attached to the top surface of interposer 108.
|
