| http://www.w3.org/ns/prov#value | - The invention also includes an alignment...http://www.google.com/patents/US6232146?utm_source=gb-gplus-sharePatent US6232146 - Semiconductor device including combed bond pad opening, assemblies and methodsAdvanced Patent SearchPublication numberUS6232146 B1Publication typeGrantApplication numberUS 09/314,873Publication dateMay 15, 2001Filing dateMay 19, 1999Priority dateDec 31, 1997Fee statusPaidA
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