| http://www.w3.org/ns/prov#value | - The substrate which has been provided thereon with a tantalum nitride film having a desired thickness may, if necessary, further be treated by applying a voltage to a target while using a sputtering gas such as Ar gas to thus generate plasma and then sputtering the target according to the usual sputtering technique to thus form a metal thin film or an adhesive layer on the side of an electrical co
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