| http://www.w3.org/ns/prov#value | - The semiconductor industry is driven by automation and smaller packages and is presently producing devices with the so-called TAB, i.e. Tape Automated Bonding, technique in which the tape, is comprised of an insulating carrier, formed of a material such as polyimide or the like, carrying a multiplicity of thin metallic films which extend beyond openings in the polyimide to form what are generally
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