| http://www.w3.org/ns/prov#value | - The semiconductor package according to claim 2, wherein the lower barrier layer comprises one selected from group consisting of Ti/W, Cr+Ni, Ti/W+Ni and Cr+Co+Ni, having a thickness of 2000 to 5000 ???, the seed layer comprises one selected from group consisting of Cu, Au, Cr and Ni, having a thickness of 1 to 5 ??m and the metal layer is made of compounds such as Cu, Ni+Cu, Cu+Ni+Au or Cu+Au, hav
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