| http://www.w3.org/ns/prov#value | - The insulating material 34 can be a phosphorus-silicon glass (PSG), and the source 36 is constructed by stacking up Titanium, Titanium nitride, and Aluminum-Silicon-Copper alloy whilethe drain 38 is stacked up by conductive layer such as Titanium, Nickel, and Silver etc.Shown in FIG. 3A to FIG. 3F are schematic cross-sectional views of the fabricating process of the chip scale package of a preferr
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