| http://www.w3.org/ns/prov#value | - The die attach, in an embodiment, is an epoxy resin or other material...http://www.google.fr/patents/US6969914?utm_source=gb-gplus-shareBrevet US6969914 - Electronic device package Recherche avanc???e dans les brevets Num???ro de publicationUS6969914 B2Type de publicationOctroi Num???ro de demandeUS 10/233,262 Date de publication29 nov. 2005 Date de d???p???t29 ao???t 2002 Date de priorit???29 ao?
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