| http://www.w3.org/ns/prov#value | - The preferred embodiment of the present invention facilitates the testing of devices that use surface mounting such as ball grid array (BGA) modules, column grid array (CGA) modules, and flip chip modules that use solder ball or column arrays for connecting the module to the system board (which can comprise things such as printed circuit boards (PCB), semiconductor devices, and/or other packaging
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