| http://www.w3.org/ns/prov#value | - The mode ofimplementation is flip-chip mounting, whereas the bump electrodes 25 may use electrically conductive bumps including metals, such as gold bumps, nickel bumps, copper bumps, and electrically conductive resin bumps, and the like.Employable as bonding modes are those of direct bonding, underfill resin filling, anisotropic conductive film (ACF), anisotropic conductive paste (ACP), nonconduc
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