| http://www.w3.org/ns/prov#value | - Thus, the cooling structure 200 of FIG. 2 has the advantage of utilizing a first thermal conductivity material for the fins (e.g., copper), and a second thermal conductivity material for the base, which can be attached to a silicon chip with an excellent interface without concerns related to a coefficient of thermal expansion mismatch (which is a common problem with many previous cooling structure
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