| http://www.w3.org/ns/prov#value | - Thus, the packaging method of the present invention eliminates the need to individually align individually packaged semiconductor devices with test equipment. [0083]FIGS. 10A and 10B illustrate an embodiment of chip-scale package 410 wherein a carrier substrate 418 includes an insulative layer 430 of a material such as polyimide or another elastomer disposed adjacent an active surface 414 of a sem
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