| http://www.w3.org/ns/prov#value | - Thus, according to the present invention, connection of the object having a portion connected by a metal or an alloy such as a mounted substrate wherein, for example, a printed circuit board and various kinds of electronic components are connected by a solder alloy such as Pb???Sn, can be disconnected from connection, in addition, even when a hazardous metal such as lead, for example, is contained
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