| http://www.w3.org/ns/prov#value | - This invention relates to fluxing underfill compositions useful for fluxing metal surfaces in preparation for providing an electrical connection and sealing the space between semiconductor devices, such as chip size or chip scale packages (???CSPs???), ball grid arrays (???BGAs???), land grid arrays (???LGAs???), flip chip assemblies (???FCs???) and the like, each of which having a semiconductor c
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