| http://www.w3.org/ns/prov#value | - The transfer material 2001B has substantially the same configuration as the transfer material 2001A shown in FIG. 19A. However, in this embodiment, not only a passive component such as the inductor 2103, the capacitor 2104, the resistor 2105, etc., but also a positive component such as a semiconductor chip 2106, etc. is flip-chip mounted on a connection portion 2107 so that the components are adhe
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