| http://www.w3.org/ns/prov#value | - These circuit layers on the flex carrier 2 will consist of electrically conductive material such as copper or aluminum added onto the dielectric material by plating conductor lines on a conductive seed layer, or by covering the entire surface of the dielectric layer of carrier 2 with metal and then removing the unwanted material by etching, or other processes, to leave the conductive signal lines
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