| http://www.w3.org/ns/prov#value | - The present invention provides a cost effective, efficient technique for forming a high conductivity interconnect pattern with high reliability by electroplating or electrolessly plating Cu or a Cu-base alloy on a seed layer comprising an alloy of Cu and a refractory metal, such as Ta or W. In accordance with the present invention, interconnection patterns are reliably formed with filled openings
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