| http://www.w3.org/ns/prov#value | - Then, the printed circuit board using the adhesive for electroless plating according to the present invention is a printed circuit board comprising a substrate, a cured adhesive layer for electroless plating having a roughened surface, and a conductor circuit formed on the roughened surface of the adhesive layer, this adhesive layer is composed of an adhesive for electroless plating formed by disp
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