| http://www.w3.org/ns/prov#value | - The method of claim 1 wherein the retention member removably engages a surface of the microelectronic device and the support member is a first support member, and wherein the method further comprises electrically coupling the first support member to a second support member by attaching solder balls projecting from the second surface of the first support member to solder ball pads of the second sup
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