| http://www.w3.org/ns/prov#value | - The heat spreaders are thus prevented from defects such as peeling and cracking, which adversely affect semiconductor devices. [0027] The present invention, therefore, can provide a reliable heat spreader having high thermal conductivity across the plane and thickness; sufficient strength, flatness, and air-tightness; good adhesiveness to semiconductor devices and sealing materials for package bod
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