| http://www.w3.org/ns/prov#value | - The semiconductor test unit of claim 2, wherein the deformation suppression portion comprises any one of resins including epoxy resins, his-maleimide-triazine resin, PEEK resin, and butadiene resin; polyolefins including polyethylene and polypropylene; polydienes including polybutadiene, polyisoprene, and polyvinylethylene; acrylic resins including polymethylacrylate and polymethyl methacrylate; p
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