About: http://webisa.webdatacommons.org/306600865

Property	Value
http://www.w3.org/1999/02/22-rdf-syntax-ns#type	http://www.w3.org/ns/prov#Entity
http://www.w3.org/ns/prov#value	The present invention relates to a semiconductor device and a manufacturing method therefor, and more particularly to a semiconductor device capable of being diced and die-bonded stably and a manufacturing method to make such devices.
http://www.w3.org/ns/prov#wasQuotedFrom	google.es