| http://www.w3.org/ns/prov#value | - The thermoconductive polymers 220 of the present invention are also desirable for polishing metalization materials such as W, Ti, Cu, Al, and other metals, including Ru, Os, Co, Pt and Ta, as well as nitrides or barrier materials such as Si3N4, TaN, TiN. Moreover, the CMP apparatus 250 incorporating the thermoconductive polymer 220 of the present invention may be applied in a variety of polishing
|
