| http://www.w3.org/ns/prov#value | - hamber having an inductive coil and a target comprising the material to be sputtered, one or more plasma gases having high molar masses relative to target material such as xenon or kryptonUS6255212Apr 19, 1999Jul 3, 2001Micron Technology, Inc.Method of making a void-free aluminum filmUS6365514 *Dec 23, 1997Apr 2, 2002Intel CorporationTwo chamber metal reflow processUS6376355 *Aug 19, 1998Apr 23, 2
|
