| http://www.w3.org/ns/prov#value | - When the substrate has on its both sides conductive metal layers and is provided with through-holes, following etching, the entire surfaces of both sides are covered, except portions corresponding to the through-holes, with a resist and the inner wall surfaces of the through-holes are plated with an electroless deposit of a conductive metal, optionally followed by electro-deposition of a conductiv
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