| http://www.w3.org/ns/prov#value | - Thus, when, for example, the semiconductor device serving as the object to be tested is inserted in the IC socket to which the probe 1 according to the present invention is attached, the terminals such as BGA or the like formed on the package of the semiconductor device are pressed against the front end 3 a of the plunger 3, and the plunger 3 retreats inside the barrel 2 against the urging force d
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