| http://www.w3.org/ns/prov#value | - The intermediate layer 31 is electrically connected to ground pads 32 of the semiconductor element 12 via through holes 34 and bump electrodes 33. [0042] Further, the intermediate layer 31 is electrically connected via through holes 5 a to a seal ring 4 formed on the board and external terminals 18 a connected to ground. [0043] External electrodes 18 supplied with signals such as an input and an o
|
