| http://www.w3.org/ns/prov#value | - The system of claim 9, wherein the surface of the wafer includes a layer to be etched and a photoresist layer, the photoresist layer being formed on the layer to be etched except for a peripheral portion adjacent to the peripheral edge;the system further comprising detecting means for detecting the end point of the treatment of the wafer, the detecting means being positioned opposite to and above
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