| http://www.w3.org/ns/prov#value | - The present invention relates to a pressurizing apparatus and a pressurizing method for pressurizing bonding sheets including anisotropic conductive film tape (ACF tape), film-like components including flexible printed circuit boards (FPC boards), electronic components, optical components, and the like against a first component, such as a plasma display panel board (PDP board) or a liquid crystal
|
