| http://www.w3.org/ns/prov#value | - The extra wafer is caused to be present within the cleaning processing system 1 in, for example, the case where the power supply within the cleaning processing system 1 is unavoidably cut off during operation of the cleaning processing system 1 by the power failure due to the natural calamity such as an earthquake or a typhoon, and in the case where the power supply within the cleaning processing
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