| http://www.w3.org/ns/prov#value | - If desired, the substrate can be vibrated or agitated such as at about 20-30 cycles with a lateral displacement of about 50-200 mils or at about 120-160 cycles with a lateral displacement of about 5 to about 25 mils to assure removal of any particles, and air blown to further assure removal therefrom of any particles remaining from the soldering mask.
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